G09800 - SEMI G98 - Specification for Coefficient of Thermal Expansion (CTE) of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging Revision:SEMI G98-1122 - Current Chips and scratches can be

Chips and scratches can be origins for crack generation

The purpose of this Test Method is to define a method for determining numerical values for surface roughness parameters measured on gas distribution system components

and thickness of the gold plating shall be specified per MIL-G-45204 unless otherwise agreed between vendor and customer

This Standard recommends using additional metrologies for measurements of CMP pad density

G09800 - SEMI G98 - Specification for Coefficient of Thermal Expansion (CTE) of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging Revision:SEMI G98-1122 - Current Chips and scratches can beMold resin material characteristics are specified for legacy packages such as leaded and ball grid array packages, but there is no specification for encapsulation characteristics for wafer level packaging (WLP) and panel level packaging (PLP). Three different types of encapsulations such as liquid, granular and sheet material are used for WLP and PLP and these requires the different characteristics and performances. The characteristics of