P01100 - SEMI P11 - アルカリ現像溶液に対する全規定度の測定のテスト方法 StdPbc-0124 Deep reactive ion etching (DRIE)

Deep reactive ion etching (DRIE) is widely used in MEMS fabrication processes for creating high-aspect ratio anisotropic features

The process induced defects consist of chips/indents (surface and edge) and cracks (not to mention the surface itself)

1グレードの窒素およびアルゴンバルク供給ガスの最大許容パーティクル濃度を設定すること(2)その確認のための基準方法を記述することである。

This Practice reduces the effects of image-contrast variation on measurements with these different systems

P01100 - SEMI P11 - アルカリ現像溶液に対する全規定度の測定のテスト方法 StdPbc-0124 Deep reactive ion etching (DRIE)NOTICE: This translation is a REFERENCE COPY ONLY. If differences should exist between the English version and a translation in any other language, the English version is the official and authoritative version. SEMI SEMI global Liquid Chemicals Committee20071220global Audits and Reviews Subcommittee20082www. semi. org199119979 NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not