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G06600 - SEMI G66 - 半導体用プラスチックモールディングコンパウンドの吸湿特性の測定方法 Revision:SEMI G66-96 (Reapproved 0811) - Superseded SEMI G77 — Specification for
G06600 - SEMI G66 - 半導体用プラスチックモールディングコンパウンドの吸湿特性の測定方法 Revision:SEMI G66-96 (Reapproved 0811) - Superseded SEMI G77 — Specification for
$115.50
Description
SEMI G77 — Specification for Frame Cassette for 300 mm Wafers
used to ship
SEMI M8-93 (technical revision)
The dynamic test method evaluates performance during component operation and provides an indication of the steady state particle contribution due to dynamic operating conditions
G06600 - SEMI G66 - 半導体用プラスチックモールディングコンパウンドの吸湿特性の測定方法 Revision:SEMI G66-96 (Reapproved 0811) - Superseded SEMI G77 — Specification forglobal Assembly & Packaging Technical Committee201171global Audits and Reviews Subcommittee20118www. semiviews. org www. semi. org1996200411 : Referenced SEMI Standards None.
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 - Superseded SEMI G77 — Specification for){kind=link}
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