E17600 - SEMI E176 - Guide to Assess and Minimize Electromagnetic Interference (EMI) in a Semiconductor Manufacturing Environment Revision:SEMI E176-1017 - Superseded SEMI T3 — Specification for

SEMI T3 — Specification for Wafer Box Labels

01 ppba and 5 ppba for each of the electrically active elements

本試験方法の目的は，MFCに関わる取付姿勢の影響を定量化する標準方法を提供することである。

1-0414 — Specification for SOAP Binding for Equipment Self Description (EqSD)

E17600 - SEMI E176 - Guide to Assess and Minimize Electromagnetic Interference (EMI) in a Semiconductor Manufacturing Environment Revision:SEMI E176-1017 - Superseded SEMI T3 — Specification for1 Purpose 1. 1 The purpose of this Guide is to provide guidance for the assessment and minimization of electromagnetic interference (EMI) in a semiconductor manufacturing environment to improve yield, equipment availability, and test results (e. g., testing time, measurement relevance, repeatability, and accuracy). 2 Scope 2. 1 This Guide applies to equipment and facilities provided for the purpose of manufacturing semiconductor devices (i. e.,