86 mm OD x 0.1 mm Thickness Diamond Dicing Blades - EQ-EC422-Blade Wafer Holders Film target thickness: 11 um

Film target thickness:       11 um  with  (thickness acceptation range) +/- 10%

One order has 5 pieces of gasket

& Dimensions   Applications   Optional 4-pin electrical wires are available at the options bar (Pic

7mm (ID) x 73

86 mm OD x 0.1 mm Thickness Diamond Dicing Blades - EQ-EC422-Blade Wafer Holders Film target thickness: 11 umSPECIFICATIONS: Part Number EQ EC 422 Blade Material Nickel bounded Stainless Steel Blade Diameter 86mm OD x 70 mm ID Blade Thickness 0. 1mm Center hole 0. 5" Grain Size 14 microns Features High precision cutting for hard and brittle nonmetal materials such as Si, Ge, Quartz, Ceramic, Ferrite and Glass, etc. Designed for SYJ 400 Dicing saw and Compatible with any dicing saw with 0. 5" diameter shaft. Replacement blade for aluminum alloy flange (not