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Environmental testing - Tests. Test Te. Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method Ingestion-build-239834 BS 3900-E6:1992
Environmental testing - Tests. Test Te. Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method Ingestion-build-239834 BS 3900-E6:1992
$116.00
Description
BS 3900-E6:1992
Part 9: Field vane test
3 Instructions for use
Association of British Insurers (ABI)/Norwich Union
Environmental testing - Tests. Test Te. Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method Ingestion-build-239834 BS 3900-E6:1992BS EN 60068 2 69: 2007outlines test Te, solder bath wetting balance method and solder globule wetting balance method, applicable for surface mounting devices. These methods determine quantitatively the solderability of terminations on surface mounting devices. BS EN 60068 2 69: 2007 is also available for surface mounting devices and should be consulted if applicable. The procedures describe the solder bath wetting balance method and the solder globule
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